Semiconductor and IC Packaging Materials Market Size, Forecast and Outlook (2024-20

Global Semiconductor and IC Packaging Materials Market reached US$ 43.1 billion in 2023 and is expected to reach US$ 93.7 billion by 2031, growing with a CAGR of 10.2% during the forecast period 2024-2031.

The growth of electronic hardware needs the use of computational power capable of delivering great performance, speed and bandwidth while maintaining low latency and power consumption. Advance packaging technologies are ideally adapted to fulfill these different performance expectations and the advanced heterogeneous integration requirements, thus allowing enterprises to capitalize on the shifting demands of high-speed computing, artificial intelligence and 5G.